Thermal and Mechanical Modeling

Responsibility:

1.Conduct thermal and thermal-stress coupled modeling and simulation in IC design, including but not limited to thermal conduction, thermal expansion, thermo-mechanical coupling, electro-thermal coupling, and electromagnetic coupling and more multiphysics analysis.
2.Utilize numerical simulation methods for thermal and stress analysis, optimize design, and resolve potential thermal management issues.
3.Perform thermal and stress modeling with commercial simulation tools to ensure performance and reliability requirements are met; lead the optimization and iteration of in-house thermal simulation tools; edit and optimize numerical equations to improve simulation accuracy and efficiency.
4.Collaborate closely with cross-functional teams, providing technical support in thermal and stress modeling to ensure successful implementation of design solutions.
5.Continuously improve modeling methodologies and simulation workflows to enhance overall R&D efficiency.

Requirenment:

• Experience of novel heatsink design (eg. lid or coldplate with microchannels), including the microchannel topology and interface design, simulation and optimization
• Strong foundation in mathematics, physics, and thermodynamics, especially in heat conduction, thermal-stress coupling analysis, and materials science.
• Familiarity with thermal transportation, thermal-mechanical coupling and CFD-based modeling methods, and proficiency in numerical simulation techniques (e.g., finite element or finite volume analysis).
• Proficient in using mainstream simulation software.
• Relevant experience in semiconductor, with the ability to understand and address thermal stress issues in semiconductor.
• Familiarity with programming languages such as Python and C++, with the capability to independently develop scripts or implement data-driven modeling workflows.
• Experience in applying AI / machine learning techniques (e.g., surrogate modeling, model order reduction, design optimization, or automated parameter tuning) to enhance simulation accuracy or efficiency is highly preferred.
• Prior work experience in semiconductor is preferred.

Educational Requirements

Master's degree or above in Electrical Engineering, Physics, Mechanical Engineering, or related fields (PhD. or equivalent degree).

Work Experience

PHD years

Msc years